Problem

The III-V photonics, RF and power electronics industries are challenged by new applications demanding faster, more efficient and higher power devices. However, current performance is limited by heat generated inside the devices and poor thermal transport through the III-V substrate.

Solution

CoolSem’s technology removes the III-V substrate and the resulting Thin-Film device is directly attached to a heat sink or heat spreading layer. Improved heat flow out of the device results in new levels of performance. The technology is cost-effective, and the valuable substrate (GaAs, InP) can be reused.
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Applications

Devices made with CoolSem’s technology provide reliable thermal management for high-performance lasers, RF and power devices, with applications in telecom, sensing, space, defense and consumer electronics. They are the solution for applications requiring exceptional performance, efficiency or reliability.